Product Information

Sicreat's silicon wafer business covers all-size customized processing technology, mainly including silicon wafer grinding, polishing, thinning, chamfering, laser marking, and other processes technics. Our wafer can be customized to produce thicknesses ranging from 100um to 800um, diameter from 2 inches to 12 inches. In addition, Sicreat can also make a variety of high, medium, and low-resistance silicon wafers, and its TTV and roughness can meet the requirements of SEMI standards.